JPH0553310B2 - - Google Patents

Info

Publication number
JPH0553310B2
JPH0553310B2 JP1234152A JP23415289A JPH0553310B2 JP H0553310 B2 JPH0553310 B2 JP H0553310B2 JP 1234152 A JP1234152 A JP 1234152A JP 23415289 A JP23415289 A JP 23415289A JP H0553310 B2 JPH0553310 B2 JP H0553310B2
Authority
JP
Japan
Prior art keywords
resin
plating film
plating
lead frame
noble metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1234152A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02110982A (ja
Inventor
Shingo Fujii
Hiroshi Kiryama
Masami Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1234152A priority Critical patent/JPH02110982A/ja
Publication of JPH02110982A publication Critical patent/JPH02110982A/ja
Publication of JPH0553310B2 publication Critical patent/JPH0553310B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Led Device Packages (AREA)
JP1234152A 1989-09-08 1989-09-08 半導体装置の製造方法 Granted JPH02110982A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1234152A JPH02110982A (ja) 1989-09-08 1989-09-08 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1234152A JPH02110982A (ja) 1989-09-08 1989-09-08 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH02110982A JPH02110982A (ja) 1990-04-24
JPH0553310B2 true JPH0553310B2 (en]) 1993-08-09

Family

ID=16966465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1234152A Granted JPH02110982A (ja) 1989-09-08 1989-09-08 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH02110982A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07104183B2 (ja) * 1990-11-30 1995-11-13 日本電装株式会社 自発光指針
JP4316019B2 (ja) * 1996-10-01 2009-08-19 株式会社東芝 半導体装置及び半導体装置製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571045A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Lead frame
JPS574183A (en) * 1980-06-10 1982-01-09 Toshiba Corp Metallic thin strip for installing semiconductor light-emitting element

Also Published As

Publication number Publication date
JPH02110982A (ja) 1990-04-24

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